Large BGA

Z Adjust

Heat Sink

Die Probe

 
 
 
 
 
 
 
Serving the ATE industry for 25 years, Extensive boards design experence, including mixed signal ande high speed digital applications
Semiconductor Test Interface Products

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  Package Requirements  
* Device Package
* Package Size (mm) X    Y 
* Device Pitch
* Device Pin Count
* Matrix (Rows/Columns) x
* Pin Matrix Pattern View Layouts
* PCB Alignment Pin Location  View Pin Locations
* Device Test Speed
* Inductance
     
     
  Attach Package Drawing
   
  Lid Requirements  
* Lid Type
  Heat dissipation required
  Other Lid features
     
  Application Requirements  
  Used with handler
  To be used for hand test
  If handler, what type
  Other requirements
     
  Quantity and Delivery
* Quantity of Lids
* Quantity of Sockets
* Desired Delivery Date
   

Standard lead time is 3-4 weeks ARO

 
   
Test Sockets: Test Sockets, Elastomer, Large BGA, Small BGA, QFN, QFP, GCI, Available Sockets
ATE Boards: Advantest, Credence, Agilent, LTX, MCT, Mosaid, Schlumberger, Teradyne
 Our Services: PCB design&layout, PCB FAB, PCB Conversion, Custom Test Fixturing, PCB CAM

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