QFP Sockets

The M&M Center Guided QFP Socket is designed for up to 24mm BGA package. It will work down to 0.4mm pitch device. It has a floating plate design to help locate the device before contact with the spring probes. The center float can also contain spring probes for an EPad device We have also created a center heat sink for high power devices. We offer a clip-on lid for easy change from hand test and back. The “Standard” lid offers automatic adjustment for package variance. The “DIE Probing” lid opens for die probing of the device.