GCI

GCI is an interposer made on FR4 or Kapton substrates. The interposer acts as a "contact set" which is housed and pinned in the socket body. This interconnect technology can also be applied directly to your PCB in the DUT area. The interconnect points are copper based, which is nickel and gold plated. Prior to plating, the pads are laser machined to result in a textured surface finish, which is utilized to break the device oxide layers. This highly planar interconnect methodology is recommended for use with MLF, QFP, TSOP, SOIC, TSSOP, CSP and small BGA applications. This interface is also recommended as a intermediary interface between large BGAs and a conductive elastomer.

Contact Resistance: <20mOhm
Interconnect Force Required: 10 to 15g per I/O
Contact Height: <0.012" overall thickness
Pitches Down to 0.4mm
Cycle Life: 100,000 cycles
Inductance: 0.2nH
Frequency (max): 10GHz
Current Carrying Capability: 0.5Amp
Caplanarity<.004"